Interface Circuit 11726909 Materials, Methods, and Technology Program.

Abstract

This report summarizes a materials, methods, and technology program associated with a hybrid microelectronic, special-purpose interface circuit for use in the M587 and M724 Electronic Timing Fuzes. The pilot production phase of this 4-phase program provided operation rates and yield data necessary to make realistic cost estimates of high-volume production of this hybrid. To help reduce production costs, this hybrid interface circuit employs a custom-designed monolithic integrated circuit. Transfer molding packaging techniques were developed to meet demanding environment requirements that include 30 KG mechanical shock. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1980
Accession Number
ADA082769

Entities

People

  • B. T. Joyce
  • J. A. Brady
  • J. G. Bouchard

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Acceptance Tests
  • Assembly
  • Contracts
  • Engineering
  • Fabrication
  • Failure Analysis
  • Integrated Circuits
  • Manufacturing
  • Mass Production
  • Production
  • Production Rate
  • Productivity
  • Quality Control
  • Semiconductors
  • Test And Evaluation
  • Test Equipment
  • Test Methods

Readers

  • Integrated Circuit Design and Technology.
  • Life Cycle Cost Analysis
  • Software Engineering

Technology Areas

  • Microelectronics