Interactive Effects of Bond Wires Used for Microwave Semiconductor Device Combining and Matching Circuitry.

Abstract

For arrays of bond wires, inter-wire coupling can significantly affect the parameters of the individual wires. Design information is given for two port problems consisting of multiple bond wire arrays over a ground plane. Secondly, bond wire coupling can degrade the combining efficiency of several wire-combined solid state devices (such as transistor unit cells). This problem is modeled and analyzed, and remedies are suggested. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Mar 05, 1980
Accession Number
ADA083920

Entities

People

  • B. E. Spielman
  • H. A. Willing
  • R. E. Neidert

Organizations

  • United States Naval Research Laboratory

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Gaps
  • Bipolar Junction Transistors
  • Circuits
  • Diodes
  • Electronics
  • Electronics Laboratories
  • Elements
  • Equivalent Circuits
  • Field Effect Transistors
  • Frequency
  • Impedance
  • Measurement
  • Security
  • Semiconductor Devices
  • Semiconductors
  • Transistors
  • Transmission Lines

Readers

  • Integrated Circuit Design and Technology.
  • Microwave Engineering.
  • Quantum Chemistry

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems