The Effects of Substrate Composition of Thick Film Circuit Reliability.

Abstract

The dissolution of an alumina substrate (AlSiMag 614) into the glass phase of a thick film resistor during firing was found to markedly increase the viscosity, and to decrease the surface tension and density of the glass. These changes in glass properties cause an increase in the sheet resistance and a decrease in the TCR of the resistors. The minor constituents in the substrate were found to exert a larger effect on glass properties than their concentration (4%) suggests. The models for microstructure development and charge transport in thick film resistors were modified in order to accommodate the effect of the resistor-substrate interaction. The results of this study led to specific recommendations for quality control of substrate chemistry, and for composition of resistor glasses. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Feb 28, 1980
Accession Number
ADA084261

Entities

People

  • R. W. Vest

Organizations

  • Purdue University

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Capacitance
  • Chemistry
  • Dielectric Permittivity
  • Dissipation Factor
  • Electrical Properties
  • Film Resistors
  • Films
  • Materials
  • Materials Processing
  • Materials Science
  • Measurement
  • Photoelectrochemical Cells
  • Resistance
  • Resistors
  • Silica Glass
  • Thick Films
  • Thin Films

Readers

  • Software Engineering
  • Surface Coatings Technology.