Ultrasonically Activated Diffusion Bonding for Fluidic Control Assembly
Abstract
Modified ultrasonic metal bonding equipment was used to develop a new fluidic stack assembly process. Ultrasonically activated diffusion bonding was successfully applied to aluminum laminates of different sizes (up to 1 by 1 inches), different foil thicknesses (2, 3, and 5 mils), and different number of layers (up to 18). Bonds were obtained without excessive deformation, within a few second of ultrasonic bonding time, on as-received surfaces, with special atmospheres, on commercially prepared etched foil fluidic laminate stacks. Bonds were judged good quality from visual examination of stack surfaces and edges, from electrical resistance measurements made face to face, and from photomicrographic analysis of assembly cross sections. Analysis of the bonding system led to establishment of fundamental bonding parameters and equipment requirements for assembly of larger and thicker stacks. Investigation of the use of increased ultrasonic power for assisting the diffusion bonding of fluidic elements verified the fact that increased areas and/or thickness of laminates can be joined, but that dedicated tooling must be developed to assure the success of the process development.
Document Details
- Document Type
- Technical Report
- Publication Date
- Feb 01, 1979
- Accession Number
- ADA084658
Entities
People
- Howard A. Scheetz
- Janet Devine
- Paul L. Coppa