Gold Plated Lead-Clinched Lead Solder Joint Study.

Abstract

In this study the effects of soldering to gold-plated lead wires as opposed to soldering to pretinned or double-tin dipped lead wires are investigated. Also investigated were the differences between Types I, II, and III lead termination methods as described in MIL-P-46843, Paragraphs 3.6.4.3.7, 3.6.4.3.8, and 3.6.4.3.9 respectively. Data generated may be utilized in the design of printed circuit boards, the revision of soldering and component specifications, and for decision criteria upon which engineering changes may be evaluated. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1979
Accession Number
ADA087352

Entities

People

  • Roger L. Yocom

Organizations

  • United States Army Aviation and Missile Command

Tags

Communities of Interest

  • Weapons Technologies

DTIC Thesaurus Topics

  • Air Force
  • Air Force Facilities
  • Circuit Boards
  • Creep
  • Creep Tests
  • Databases
  • Engineering
  • Failure Mode And Effect Analysis
  • Lead Wires
  • Materials
  • National Security
  • New York
  • Printed Circuit Boards
  • Printed Circuits
  • Security
  • Standards
  • Test Equipment

Readers

  • Software Engineering
  • Surface Engineering/Surface Coating Technology.