Parametric Analysis of Energy Consumption in Army Buildings by the Building Loads Analysis and System Thermodynamics (BLAST) Computer Program.

Abstract

This report describes the effects varying architectural, construction, and mechanical system features have on the energy consumption of three Army buildings: a barracks, an administration building, and a dental clinic. The three buildings were simulated for five climatological regions centered at Washington, DC; Charleston, SC; Los Angeles, CA; Columbia, MO; and Fort Worth, TX. Energy consumption simulations were done by the Building Loads Analysis and System Thermodynamics (BLAST) computer program. The report shows the percentage difference in annual heating and cooling energy use for three buildings and five locations when variations from the as built insulation levels, orientation, window areas, window types, infilitration levels, mechanical system, and system control strategies are used. It was concluded that insulation levels, window size and type, and infiltration/ventilation rates are the most important architectural and construction features affecting the degree of energy consumption, and that proper selection of mechanical system type and system control strategies can reduce annual energy consumption by up to 50 percent. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1980
Accession Number
ADA089406

Entities

People

  • Larry M. Windingland

Organizations

  • Construction Engineering Research Laboratory

Tags

Communities of Interest

  • Biomedical
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Temperature
  • Computer Programs
  • Construction
  • Department Of Defense
  • Energy
  • Energy Conservation
  • Energy Consumption
  • Energy Systems
  • Engineering
  • Heat Energy
  • Heat Transfer
  • Heat Transfer Coefficients
  • Load Monitoring
  • Military Facilities
  • Storage
  • Thermodynamics
  • United States

Fields of Study

  • Engineering

Readers

  • Electrical Engineering
  • Environmental Remediation and Restoration.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics