Reliability Evaluation of Plastic Encapsulated Hybrid Microcircuits Developed for Army Fuze Applications.

Abstract

A major Army rocket system may incorporate the use of an electronic fuze timer fabricated using two plastic encapsulated hybrid microcircuits and one encapsulated monolithic integrated circuit. The Electronics Technology and Devices Laboratory at Fort Monmouth, New Jersey was tasked with assessing the storage reliability of these devices through accelerated testing and detailed failure analysis to determine failure mechanisms. From this analysis, corrective actions would be proposed which could permit attainment of the desired reliability. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1980
Accession Number
ADA089632

Entities

People

  • Edward B. Hakim
  • John Erickson

Organizations

  • United States Army Communications-Electronics Command

Tags

Communities of Interest

  • Advanced Electronics
  • Weapons Technologies

DTIC Thesaurus Topics

  • Electrical Properties
  • Electronics
  • Environmental Tests
  • Failure Analysis
  • Failure Mode And Effect Analysis
  • Fuze Setters
  • Manufacturing
  • Materials
  • Measurement
  • Reliability
  • Semiconductors
  • Shock Tests
  • Silicon Controlled Rectifiers
  • Test And Evaluation
  • Test Fixtures
  • Test Methods
  • Thermal Shock

Fields of Study

  • Engineering

Readers

  • Hydrologic Risk Analysis and Mitigation.
  • Integrated Circuit Design and Technology.
  • Logistics and Supply Chain Management.

Technology Areas

  • Microelectronics
  • Microelectronics - Microelectromechanical Systems