Electronics Temperature Control,
Abstract
The results of a preliminary study on thermal modeling and analysis of microcircuits are presented. Studies covering typical components mounting methods, bonding agent materials component spacing, and cooling concepts are described. Temperature profiles of substrates, component temperatures and thermal resistances are presented. It is shown that the use of moly tabs, sputtered beryllia and thermoelectric coolers can significantly reduce component temperature levels. Additionally, it is illustrated that thermal modeling can aid the circuit designer in the layout and preliminary design phases. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1975
- Accession Number
- ADA089744
Entities
People
- J. T. Pogson
Organizations
- Boeing