Corrosion of Metal Films with Defective Surface Protection Layers.
Abstract
Corrosion of thin-film aluminum and gold under defect-containing passivation layers of phosphorus-doped SiO2 and plasma-deposited silicon nitride was investigated. Metal test patterns with corresponding passivation patterns, including deliberate passivation defects, made it possible to measure both corrosion current and corrosion rate. Measurements were done as a function of relative humidity and temperature. Electrochemical bias techniques were used to determine the relative corrosion stabilities of various metallized substrates. Fluoride and chloride contaminants produced greatly accelerated corrosion reactions for aluminized films. Alloying aluminum films improved their corrosion stability. The H2 in the forming gas ambient during alloying further improved the corrosion stability. Measurements of film stress versus corrosion stability did not correlate well. However, films under compressive stress may exhibit an improved corrosion stability. Fluorescent pH indicators were tested as a method of decorating IC devices. On aluminized IC devices in the presence of bias, some indicators exhibited fluorescence at localized sites. The effect on corrosion current of various surface treatments such as heating, etching, storage, and surface chemical modification were examined. Application of hexamethyldisilazane reduced surface currents by a factor varying from 100X to 1000X. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 01, 1980
- Accession Number
- ADA090028
Entities
People
- G. L. Schnable
- L. K. White
- R. B. Comizzoli
- W. Kern
Organizations
- Sarnoff Corporation