Reliability Prediction Modeling of New Devices.

Abstract

This report presents reliability prediction models for high density microcircuits including magnetic bubble and charge-coupled device memories for inclusion in MIL-HDBK-217C, 'Reliability Prediction of Electronic Equipment'. The approach in this investigation was unique in that the models were developed utilizing only early device life cycle data, since there was only limited field data available. Two separate models were developed. An additive hybrid type failure rate prediction model was formulated for Magnetic Bubble Memories and for the Charge-Coupled Memory devices it was found that the NMOS Dynamic RAM model currently in MIL-HDBK-217C, Notice 1 was applicable. Both models are presented in the standard MIL-HDBK-217C format, are relatively simple to use, and allow for refinements based on field and life test data as it becomes available. Finally the models exhibit reasonable correlation with existing field data. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1980
Accession Number
ADA090029

Entities

People

  • Martin Cohen
  • Roger G. Long

Organizations

  • Arthur D. Little

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Charge Coupled Devices
  • Electronic Equipment
  • Electronics Industry
  • Electronics Laboratories
  • Engineers
  • Failure Mode And Effect Analysis
  • Integrated Circuits
  • Magnetic Domains
  • Magnetic Materials
  • Memory Devices
  • Modules (Electronics)
  • Printed Circuits
  • Reliability
  • Semiconductor Devices
  • Semiconductors
  • Solid State Electronics

Fields of Study

  • Engineering

Readers

  • Computational Fluid Dynamics (CFD)
  • Integrated Circuit Design and Technology.
  • Regression Analysis.

Technology Areas

  • Microelectronics