Role of Microstructure in High Temperature Oxidation.

Abstract

The major objective of this research work was to study the influence of minor impurity elements present in nickel upon its oxidation behavior, specifically as regards the correlation between scale thickening and its concurrent microstructural evolution. Materials chosen for this work were Nickel 270 and a nickel of lower purity, Nickel 200. The Nickel 270 served as a standard of comparison for the oxidation behavior of Nickel 200. Initially the research activity was concentrated on a study of the microstructural evolution of the inner scale layer and the metal-oxide interface of Nickel 270. The results of this work combined with those of a previous research dealing with the outer scale layer formed a basis of comparison for the work on Nickel 200. A secondary study was made of the oxidation behavior of high purity copper in air at 800 C where the predominant oxide is CuO. The scale thickening and microstructural evolution of CuO formed under these conditions are similar to the oxidation behavior of Nickel 270.

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1980
Accession Number
ADA090235

Entities

People

  • F. N. Rhines
  • M. S. Choi
  • R. G. Connell Jr.

Organizations

  • University of Florida

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Composite Materials
  • Creep
  • Crystal Lattices
  • Crystal Structure
  • Crystals
  • Geometric Forms
  • Geometry
  • Lines (Geometry)
  • Materials
  • Materials Science
  • Measurement
  • Mechanical Properties
  • Microscopy
  • Normal Distribution
  • Plastic Flow
  • Surface Finishing
  • Surface Tension

Fields of Study

  • Materials science

Readers

  • Metallurgy
  • Nanoscale Plasmonic Nanotechnology
  • Petroleum Engineering