Fatigue Microcrack Behavior under the Influence of Surface Residual Stresses.

Abstract

Direct observations of the surface crack opening displacement (SCOD) of surface and corner cracks were made on samples of Ti-6Al-4V under both cyclic and static loading conditions. The observations were conducted in a specially designed loading stage in-situ in a scanning electron microscope. Cracks from 7-1300 microns have been studied by this technique. Results show that surface residual stresses can significantly affect crack opening behavior, thus crack growth behavior, even when the crack has grown well beyond the zone of residual stress. Concurrent with experimental efforts, an analytical approach has been developed and used to predict SCOD for Mode I surface microcracks based on crack geometry. Correlation with independent results for macrocracks and values for microcracks measured in this program are excellent. In addition, an existing computer program has been successfully used to predict SCOD of corner cracks in the absence and presence of an imposed compressive residual stress field. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1980
Accession Number
ADA090561

Entities

People

  • Gerald R. Leverant
  • John E. Hack

Organizations

  • Southwest Research Institute

Tags

Communities of Interest

  • Cyber

DTIC Thesaurus Topics

  • Computer Programs
  • Computers
  • Crack Tips
  • Electron Microscopes
  • Elements
  • Engineering
  • Fracture (Mechanics)
  • Geometry
  • Grain Size
  • Materials
  • Mechanics
  • Microscopes
  • Residual Stress
  • Scanning Electron Microscopes
  • Steel
  • Surface Properties
  • X Rays

Readers

  • Structural Health Monitoring of Composite Structures.
  • Wetland-Land-Environmental Management.

Technology Areas

  • Microelectronics