Dynamic Properties of Electronic Trapping Centers at the Si-SiO2 Interface.

Abstract

The Si-SiO2 interface possesses defects which may be considered characteristic of the thermal oxidation process. Electronic defects introduce a broad peak in the interface-state distribution which is centered approximately 0.3eV above the silicon valence-band maximum. Furnace anneals remove these levels yielding the generally observed U-shaped distribution. The ESR interface defect was evaluated over a range of annealing temperatures (less than or equal to 600 C). The spin signal rapidly decays in MOS structures annealed above 250 C. An anneal in atomic deuterium at 230 C completely annihilated the spin center, which could not be recovered with vacuum anneals up to 600 degrees C. The surface-potential dependence of the interface spin center was investigated in order to further establish the correlation between the paramagnetic defect and interface states. It was found that the ESR amplitude changes reversibly by approximately 25% as the surface potential is adjusted between inversion and accumulation conditions. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1980
Accession Number
ADA090584

Entities

People

  • N. M. Johnson

Organizations

  • PARC

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Annealing
  • Band Gaps
  • Charge Carriers
  • Electrical Measurement
  • Energy Bands
  • Fermi Levels
  • Field Effect Transistors
  • High Temperature
  • Hydrogenation
  • Low Temperature
  • Materials Processing
  • Measurement
  • Metal Oxide Semiconductors
  • Oxidation
  • Semiconductors
  • Valence Bands
  • Voltage

Fields of Study

  • Physics

Readers

  • Materials Science and Engineering.
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene