Encapsulation of Electronic Subassemblies with Thermosetting Resins. Part I,

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Document Details

Document Type
Technical Report
Publication Date
Sep 22, 1980
Accession Number
ADA091071

Entities

People

  • Pawel Rozdzial

Organizations

  • National Air and Space Intelligence Center

Tags

DTIC Thesaurus Topics

  • Acrylic Resins
  • Biomedical And Dental Materials
  • Electrical Properties
  • Emulsions
  • Encapsulation
  • Epoxy Resins
  • Material Degradation Processes
  • Materials
  • Materials Processing
  • Plastics
  • Polymeric Films
  • Production
  • Resins
  • Semiconductor Devices
  • Semiconductors
  • Thermosetting Plastics
  • Transistors

Technology Areas

  • Microelectronics