Encapsulation of Electronic Subassemblies with Thermosetting Resins. Part II. Pressure Injection with Liquid Resins,

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Document Details

Document Type
Technical Report
Publication Date
Sep 19, 1980
Accession Number
ADA091072

Entities

People

  • Pawel Rozdzial

Organizations

  • National Air and Space Intelligence Center

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Automatic
  • Circuits
  • Coatings
  • Coverings
  • Electrostatic Fields
  • Encapsulation
  • Epoxy Resins
  • Foreign Technology
  • Hardening
  • Hybrid Circuits
  • Machines
  • Materials
  • Plastics
  • Production
  • Resins
  • Resistance
  • Thermosetting Plastics

Technology Areas

  • Microelectronics