Trend Inspection Station for Printed Circuit Board Solder Joints.

Abstract

Three techniques, ultrasonic, laser/IR and video were evaluated for feasibility as solder joint defect detectors. All three were found to be feasible with a combined detection accuracy of approximately 90 percent for 19 types of defects. Detection of severe defects is near 100 percent. All three techniques should be continued for development under Phase 2 to the extent of fabricating use-size models of equipment to use the three techniques. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Apr 07, 1979
Accession Number
ADA095971

Entities

People

  • A. C. Traub
  • D. Ensminger
  • D. J. Hamman
  • R. Vanzetti

Organizations

  • Battelle Memorial Institute

Tags

Communities of Interest

  • Energy and Power Technologies
  • Sensors

DTIC Thesaurus Topics

  • Accuracy
  • Circuit Boards
  • Detection
  • Detectors
  • Electronic Components
  • Heat Transfer
  • Helium Neon Lasers
  • Infrared Detectors
  • Laser Beams
  • Lasers
  • Measurement
  • Optical Detectors
  • Surface Temperature
  • Test And Evaluation
  • Thermal Conductivity
  • Thermal Diffusivity
  • Ultrasonic Inspection

Readers

  • Aerospace Test and Evaluation
  • Integrated Circuit Design and Technology.
  • Structural Health Monitoring of Composite Structures.

Technology Areas

  • Directed Energy