Standard Solder Joint Documentation.

Abstract

The purpose of this Interim Report is to document that the required specific solder joint defects can be and have been prepared with reasonable assurance under controlled conditions. The term 'reasonable assurance is used because approximately one-third of the required defect types cannot be proven to exist except by destructive examination, e.g. metallographic sectioning and polishing. The remaining portion of this Interim Report describes the types of defects prepared, the methods of preparation and provides photographic documentation of the appearance of the solder joints.

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Document Details

Document Type
Technical Report
Publication Date
Jan 15, 1979
Accession Number
ADA095972

Entities

People

  • Donald J. Hamman

Organizations

  • Battelle Memorial Institute

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Circuit Boards
  • Circuits
  • Electronics
  • Engineering
  • Fungi
  • Graphitic Materials
  • Inclusions
  • Integrated Circuits
  • Joints
  • Materials
  • Melting Point
  • Photographs
  • Printed Circuit Boards
  • Printed Circuits
  • Soldering
  • Standards
  • Tin Compounds

Readers

  • Defense Financial Management and Audit.
  • Military Engineering.
  • Thin Film Deposition Science.