The Relationship of Structure and Properties to Deposition Conditions and the Origin of Residual Stress in CVD Silicon Carbide and Nitride.

Abstract

Two limiting factors in the acceptance of CVD SiC as a structural material have been deposition control and residual stress in the deposit. Deposition parameters have been related to morphological as well as crystallographic structures. The effect of various additions to the basic methyltrichlorosilane and hydrogen deposition gases has also been studied and the effect on structure noted. Deposition rate control through the interaction of these parameters has also been obtained. Residual stresses large enough to crack deposits have been observed. Although no quantitative model has been determined to predict these stresses, a qualitative model has been proposed which allows the trends in residual stress to be predicted. This model is based on structure. Finally, the strength of CVD SiC was determined using a biaxial tensile test to obtain a closer approximation of the as-deposited strength than is possible with three or four-point bend tests. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Feb 13, 1981
Accession Number
ADA096031

Entities

People

  • J. L. Benjamin
  • R. J. Diefendorf
  • W. A. Magee

Organizations

  • Rensselaer Polytechnic Institute

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Ceramic Materials
  • Chemical Reactions
  • Chemical Vapor Deposition
  • Crystal Structure
  • Crystals
  • Decomposition
  • High Temperature
  • Materials
  • Measurement
  • Mechanical Properties
  • Orientation (Direction)
  • Residual Stress
  • Silicon Carbide
  • Stresses
  • Tensile Stress
  • Tensile Testing
  • Vapor Deposition

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Reinforced Composite Materials
  • Surface Engineering/Surface Coating Technology.