The Effects of Reduced Atmospheric Pressure on Thermal Contact Resistance and Electronic Component Forced Air Film Coefficients

Abstract

This report summarizes the theoretical and empirical analysis performed to determine the effects of reduced atmospheric pressure (for altitudes up to 70,000 feet) on conduction and convection thermal interfaces encountered in unpressurized avionics electronic equipment bays. For the purpose of this report, the conduction thermal interface of the Improved Standard Electronic Module (ISEM) was selected for study, although the empirical results and theoretical approach revealed herein can be applied to similar conduction interfaces on other electronic modules. The results of the effects of reduced atmospheric pressure on forced-air film coefficients can be applied generally to forced-air cooling of most electronic equipment.

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Document Details

Document Type
Technical Report
Publication Date
Aug 15, 1980
Accession Number
ADA096254

Entities

People

  • Robert Evans
  • Ronald B. Lannan

Tags

Communities of Interest

  • Energy and Power Technologies
  • Weapons Technologies

DTIC Thesaurus Topics

  • Altitude
  • Avionics
  • Barometric Pressure
  • Boundary Layer
  • Coefficients
  • Convection
  • Electronic Components
  • Electronic Equipment
  • Finishes
  • Fluid Dynamics
  • Fluid Flow
  • Heat Transfer
  • Knudsen Number
  • Materials
  • Rarefied Gases
  • Surface Roughness
  • Thermal Conductivity

Readers

  • Software Engineering
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene