Deformation and Thermal Properties of Energetic Materials

Abstract

The report covers four areas of work. In the first it is shown that some polymers can sensitize explosives in impact situations. The effect is primarily a mechanical one with the production of free radicals by the polymer only of secondary importance. Chemical effects were assessed using TG. High speed photography, with the sample between transparent anvils, was used to photography impacts on polymers, explosives and layers of explosive with polymers added. Polymers which sensitize are those which fail catastrophically, either by fracture or localized adiabatic shear, and which have a low specific heat, latent heat and thermal conductivity. Hot spots in these polymers during rapid deformation can greatly exceed the polymers softening point. This was confirmed by separate experiments with a friction apparatus with hot spot temperatures recorded using I.R. techniques. The second study describes a graphical computer method for analyzing TG and DSC traces which gives all three reaction parameters (E,A,n) characterizing an nth order reaction from a single trace. The final areas of research described are concerned with the analysis of (1) isothermal kinetic data and (2) dynamic kinetic data from solid-state reactions.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1980
Accession Number
ADA096771

Entities

People

  • G. M. Swallowe
  • John Edwin Field
  • M. M. Chaudhri
  • Tong B. Tang

Organizations

  • University of Cambridge

Tags

Communities of Interest

  • Counter IED
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Body Weight
  • Chemical Reaction Properties
  • Chemical Reactions
  • Chemical Synthesis
  • Chemistry
  • Crystal Structure
  • Dermatologic Agents
  • Explosives
  • Heat Of Fusion
  • Insensitive Explosives
  • Latent Heat
  • Materials Laboratories
  • Materials Science
  • Measurement
  • Petn
  • Photography
  • Three Dimensional

Readers

  • Explosive Engineering.
  • Polymer Science and Engineering.
  • Thermal Physics or Thermal Science.