Hybrid Microcircuits, Fabrication and Assembly - Status, 1980.

Abstract

This report discusses materials and techniques now being used for the fabrication and assembly of hybrid microcircuits. Hybrid technology provides the means for assembling all major categories of electronics in relatively small enclosures to fulfill size requirements which cannot be met by more conventional packaging techniques. Analog and digital circuits as well as microwave modules are made in hybrid form. The design, fabrication and testing of hybrid microcircuits are included along with the present status of thin and thick film components and assembly techniques. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1981
Accession Number
ADA097000

Entities

People

  • Isaac H. Pratt

Organizations

  • United States Army Communications-Electronics Command

Tags

DTIC Thesaurus Topics

  • Assembly
  • Beam Leads
  • Capacitance
  • Electrical Properties
  • Electronics
  • Electronics Laboratories
  • Fabrication
  • Film Resistors
  • Integrated Circuits
  • Mass Production
  • Materials
  • Microelectronics
  • Modules (Electronics)
  • Semiconductor Devices
  • Semiconductors
  • Thick Films
  • Thin Films

Readers

  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics