Signal Processing/HgCdTe Interconnect Study for Mosaic Sensor Focal Planes.

Abstract

During the conduct of this study, Grumman has addressed the following in terms of conceptual design: Z-Technology Module Design; Signal Processing Chip Design; and Detector Array Design (PV HgCdTe). Analyses performed in conjunction with the above included: Thermal Loads; Electrical Performance Analysis of CCD; and Array to Module Bonding. The conclusion of our study is that the combination of HgCdTe and Z-technology modules can provide significant improvement in inter-module fill factor, larger dynamic range and improved clutter rejection plus greater flexibility in relative amount of on-focal plane signal processing when compared to planar arrays. We believe this this effort to have been an important step in the progress of HgCdTe technology which will ultimately provide the next generation surveillance system.

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Document Details

Document Type
Technical Report
Publication Date
Apr 13, 1981
Accession Number
ADA098821

Entities

People

  • A. Dean Markum
  • Alan Lee
  • Donald J. Carlson
  • Kirk D. Keer
  • R. Spencer Spriggs

Organizations

  • Grumman

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Space

DTIC Thesaurus Topics

  • Air Force
  • Amplifiers
  • Assembly
  • Attachment
  • Charge Coupled Devices
  • Comparators
  • Detection
  • Detectors
  • Dynamic Range
  • Electronics
  • Energy Consumption
  • Fabrication
  • Materials
  • Microprocessors
  • Scientific Research
  • Signal Processing
  • United States

Fields of Study

  • Materials science

Readers

  • Image Processing and Computer Vision.
  • Integrated Circuit Design and Technology.
  • Software Engineering