Cure Monitoring Techniques for Adhesive Bonding Techniques.
Abstract
As a result of the work reported herein a foundation has been developed for automated bonding cycle control. The monitoring system was improved through the development of a mathematical model which affords a theoretical understanding of the dielectric signals and permits their chemorheological interpretation. The mechanical reliability of the probe was improved to minimize in-process failures. It was demonstrated that the shape of the dielectric curve was dependent on the chemical composition of the adhesive and was a useful tool for the optimization of cure cycles. Environmental testing of joints containing probes indicated that combinations of moist environments and elevated temperatures caused a degradation of bond performance. However, surface treatments can be applied to the probe without destroying the dielectric monitoring capability and should be evaluated as a solution to this problem. Evidence was also developed that it may be feasible to use the probe to detect the ingress of moisture into a bonded joint. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1980
- Accession Number
- ADA099418
Entities
People
- A. Wereta Jr.
- C. A. May
- F. L. Keck
- J. S. Fritzen
Organizations
- Lockheed Martin Missiles and Space