A Surface Damage Investigation on Uniaxial Tensile Test Specimens Prepared by Common Cutting Methods

Abstract

An experimental investigation was conducted to evaluate propellant test specimen surface damage caused by three common cutting methods, each operated at three different speeds. The three methods were guillotine cutting, sawing and milling. For each set of cutting conditions (method and speed), six specimens were obtained. Three of these specimens were subjected to surface damage evaluation using a scanning electron microscope. The remaining three specimens were subjected to uniaxial tensile testing. The effects of each set of cutting conditions on specimen surface damage and the resulting mechanical property change were analyzed. It was found that saw-cut and mill-cut propellant surfaces were similar in appearance and relatively smooth, whereas guillotine- cut surfaces were more rugged and had sustained more damage as manifested in extracted, dislocated and fractured particles. However, no significant difference in uniaxial tensile properties was found between the three cutting methods or between the three cutting speeds in each cutting method. It is believed that the absence of bonding agent in the test propellant (TP-H1011) is a significant factor in the insensitivity of test specimens mechanical properties to their surface damage condition.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1981
Accession Number
ADA100517

Entities

People

  • Dale A. Wells
  • Thomas J. C. Chew

Organizations

  • Air Force Research Laboratory

Tags

DTIC Thesaurus Topics

  • Air Force
  • Ammonium Perchlorate
  • Electron Microscopes
  • Electrons
  • Materials
  • Mechanical Properties
  • Microscopes
  • Particles
  • Plastic Explosives
  • Propellants
  • Quantum Cascade Lasers
  • Scanning
  • Scanning Electron Microscopes
  • Security
  • Solid Propellants
  • Tensile Properties
  • Test And Evaluation

Readers

  • Manufacturing Engineering.
  • Mechanical Engineering/Mechanics of Materials.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics