Microdielectrometry.

Abstract

Microdielectrometry, a new cure monitoring method, was used to monitor the cure of DGEBA/MDPA at three different temperatures. The basic device and measurement system, its calibration, and data interpretation are explained. The data are shown to yield a dielectric relaxation time that can be correlated with the variation of resin viscosity during cure prior to gelation. (Author-PL).

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Document Details

Document Type
Technical Report
Publication Date
Jun 08, 1981
Accession Number
ADA100649

Entities

People

  • David R. Day
  • Huan L. Lee
  • Norman F. Sheppard
  • Stephen D. Senturia
  • Steven L. Garverick

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics
  • Weapons Technologies

DTIC Thesaurus Topics

  • Chemical Compounds
  • Chemical Engineering
  • Chemistry
  • Composite Materials
  • Dielectric Permittivity
  • Dielectric Properties
  • Electrical Engineering
  • Engineering
  • Field Effect Transistors
  • Massachusetts
  • Materials
  • Materials Engineering
  • Materials Laboratories
  • Materials Science
  • Measurement
  • Military Research
  • United States

Readers

  • Aerospace Test and Evaluation
  • Polymer Science and Engineering.