Supersaturated Aluminum Alloy Powders.

Abstract

Four aluminum alloys, designed for use at elevated temperatures, supersaturated with iron, chromium and other elements: Ti, V, Zr, were studied. The starting materials were alloy powders made by the RSR (Rapid Solidification Rate) centrifugal atomization process (approx. one million (deg C/sec)) developed by Pratt and Whitney Aircraft and extrusion bars were made from four powders. The as extruded microstructure and the microstructure of the annealed alloys at 482 C (900 F) were investigated by optical and transmission electron microscopy, and by X-ray diffraction. The microstructure included equiaxed grains of aluminum matrix and two types of precipitates, namely: Theta-Al3(Fe,Cr), and Al6(Fe,CR)--which is a metastable phase. The precipitates were different in their shape, size, distribution and location within the grains. The thermal stability of the four alloys was investigated by hardness measurements, following annealing at various temperatures. The alloy structures were found to be stable up to 400 C (750 F). Tensile properties of the alloys were investigated at room temperature, 232 C (450 F) and 332 C (630 F).

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Jul 15, 1981
Accession Number
ADA102746

Entities

People

  • Dan Shechtman

Organizations

  • Technion – Israel Institute of Technology

Tags

Communities of Interest

  • Air Platforms
  • Energy and Power Technologies
  • Space

DTIC Thesaurus Topics

  • Air Force
  • Aluminum Alloys
  • Chemical Synthesis
  • Chemistry
  • Electron Microscopy
  • Heat Energy
  • Heat Of Fusion
  • Heat Transfer
  • Heat Transmission
  • Latent Heat
  • Materials
  • Measurement
  • Mechanical Properties
  • Mechanical Working
  • Solid Solutions
  • Tensile Strength
  • Thermal Conductivity

Fields of Study

  • Materials science

Readers

  • Materials Science (Mechanical Engineering).
  • Surface Engineering/Surface Coating Technology.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics