Auger Electron Spectroscopy and Rutherford Backscattering Studies of Copper in 2024-T3 Aluminum Following Electrochemical Anodization in Phosphoric Acid.

Abstract

The effects of the electrochemical anodization of deoxidized 2024-T3 aluminum on copper were characterized by Auger electron spectroscopy and Rutherford backscattering. Anodization was performed in phosphoric acid at constant potential. Data is presented which shows that constant potential. Data is presented which shows that constant potential anodization of 2024-T3 is more efficient than aluminum in terms of oxide growth rates for short anodization times. However the maximum anodic oxide thickness achievable on the alloy is less than the pure metal. Copper is shown to be enriched at the oxide metal interface because of its diffusion from the bulk during anodization. The presence of copper at the oxide-metla interface is shown to affect oxide morphology. (Author)

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1981
Accession Number
ADA103585

Entities

People

  • J. S. Solomon

Organizations

  • University of Dayton

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Aluminum
  • Aluminum Alloys
  • Auger Electron Spectroscopy
  • Auger Electrons
  • Backscattering
  • Chemistry
  • Corrosion Resistance
  • Electron Spectroscopy
  • Elements
  • Materials
  • Materials Laboratories
  • Oxide Films
  • Phosphoric Acids
  • Physical Properties
  • Scattering
  • Spectroscopy

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Surface Engineering/Surface Coating Technology.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene