Charge Trapping in Interface Doped MNOS Structures.

Abstract

Evaporated tungsten interface dopant, oxide-nitride interface and nitride bulk traps in MNOS structures were examined using charge centroid and thermally stimulated current (TSC) techniques. Trapping in dopant traps occurred at low injected charge levels. Above a 'saturation' level trapping occurred in the nitride, and the charge centroid penetrated into the nitride. TSC measurements were made on MNS, MNOS, and interface doped MNOS devices. Analysis of TSC spectra yielded trap depths for the interface dopant and oxide-nitride interface of 1.71 - 1.86 and 0.70 - 1.34 eV respectively, and charge densities up to 6 x 10 to the 12th power/sq cm and 3 x 10 to the 13th power/sq cm respectively. A model of MNOS charging and discharging was developed. Electron charging is by Fowler-Nordheim (F-N) injection from the silicon into the oxide conduction band, trapping at the oxide-nitride interface and Poole-Frenkel (P-F) conduction in the nitride. Discharging occurs by: (1) F-N injection of holes from the silicon into the oxide valence band and recombination with trapped electrons at the oxide-nitride interface and the nitride, and (2) redistribution of trapped electrons toward the silicon via P-F conduction and F-N injection from the nitride into the silicon. Calculated write/erase and charge centroid characteristics were compared with measured data. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jul 01, 1981
Accession Number
ADA103634

Entities

People

  • William Gardner Sutton

Organizations

  • Air Force Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Acquisition
  • Air Force
  • Band Gaps
  • Band Structures
  • Charge Density
  • Conduction Bands
  • Electrons
  • Energy Bands
  • Engineering
  • Fermi Levels
  • Field Effect Transistors
  • Materials
  • Materials Laboratories
  • Measurement
  • Operating Systems
  • Semiconductors
  • Valence Bands

Fields of Study

  • Materials science

Readers

  • Clinical Trial Research.
  • Plasma Physics.
  • Semiconductor Device Technology

Technology Areas

  • Microelectronics