Silicon Quality: A Consideration for VHSI Circuit Development.
Abstract
A detailed evaluation of the quality of silicon wafers from representative domestic and foreign vendors was made. To avoid pre-selection of wafers by vendors, material was obtained directly from device manufacturers and therefore represents a statistical sampling of Si material as currently being used in production-line processing. The results of this study have shown extreme batch-to-batch variability, lack of control in material quality and, in many cases, unacceptable levels of defects in silicon wafers used in manufacturing. The development of front-and-back-surface laser-gettering procedures for improving quality is reported and newly developed techniques for stabilizing back-surface damage, using the enhanced diffusion of oxygen, are discussed. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 28, 1981
- Accession Number
- ADA105198
Entities
People
- Calvin Leung
- L. J. Palkuti
- R. Ormond
- T. J. Magee