A Study of the Unipolar Arcing Damage Mechanism on Selected Conductors and Semiconductors.

Abstract

A broad investigation, experimental and theoretical, of the mechanism of unipolar arcing has been conducted. A theoretical discussion of existing unipolar arc models is presented. Experimental and theoretical evidence is used to support the Schwirzke-Taylor Model at the expense of other models. Three current models of arc motion are examined and refuted. Experimental results show that Aluminum and various steels arc heavily, Molybdenum and Nickel to a lesser extent, and commercially prepared metallic glasses not at all. The semi-conductors showed some arcing on Germanium but none on Silicon. Experiments showed that grain boundaries play no significant role in unipolar arc initiation. Experiments were conducted in which a laser produced metallic glass is exposed to the plasma produced by the same laser pulse. The results are used to refute the microwhisker explosion models of unipolar arc initiation. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1981
Accession Number
ADA105791

Entities

People

  • Franklin Terrence Ryan
  • Stephen Tucker Shedd

Organizations

  • Naval Postgraduate School

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Boundaries
  • Chemistry
  • Electric Arcs
  • Electric Discharges
  • Electron Emission
  • Electron Microscopes
  • Electron Microscopy
  • Grain Boundaries
  • Heat Energy
  • Laser Beams
  • Laser Pulses
  • Metallic Glass
  • Scanning Electron Microscopes
  • Semiconductors
  • Transitions
  • United States
  • Voltage

Readers

  • Materials Science and Engineering.
  • Plasma Physics.
  • Theoretical Analysis.

Technology Areas

  • Directed Energy
  • Directed Energy - Pulsed-Laser Deposition
  • Microelectronics