Development of Heat Pipe Module for Power Semiconductor Cooling.
Abstract
Application of heat pipe technology to cooling problems is an efficient means to reduce hot spot temperatures; overall thermal conductance is significantly improved as compared to conduction through a solid. This effort was focussed on the design and development of a heat pipe module which could be used to retrofit an efficient cooling system to an existing Integrated Power Switch (IPS) module. The design selected maximized the thermal performance of the heat exchange system by eliminating a dielectric barrier between the IPS power strip and the heat sink. This necessitated the use of isolation between the two power strips of the IPS to maintain normal circuit insertion capability; the overall package was also electrically insulated. At constant air flow pressure drop (different flow rates) the heat pipe module provided a reduction in component temperature rise by about a factor of three (3) at equal input power, or could handle approximately three (3) times the power of the conventional IPS thermal system for equivalent temperature rise. Measured thermal resistances of .17 and .51 C/watt were obtained for the heat pipe heat exchange system and the original IPS conduction heat sink, respectively, at a pressure drop of 0.60 inches of water. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1980
- Accession Number
- ADA108333
Entities
People
- G. J. Bastien
- K. S. Sekhon
Organizations
- Hughes Aircraft Company