Electrotransport in Thin Films.
Abstract
The objective of this research was to develop a scientific perspective that forms a foundation for understanding the processes that lead to the development of holes in thin film metal strips. This understanding allows the prediction and control of hole formation in thin film connectors that are in integral part of all microelectronic devices, thus extending their design lifetime, and improving their reliability. This project focused upon the effects of dopants on the behavior of thin films subject to high current densities, and upon the relative contributions of the several mass transport processes that may contribute to changes in the structure of film strips. Specifically, in addition to electrotransport, which may involve both electron wind and electrolysis effects, grain boundary grooving, driven by surface tension forces, and thermotransport, driven by temperature gradients, was found to significantly alter the structure of the strip. Experimental strategies have been developed which emphasize each of these contributions,, permitting assessment of their relative roles in the overall process.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 27, 1981
- Accession Number
- ADA108421
Entities
People
- R. E. Hummel
- R. T. Dehoff
Organizations
- University of Florida