Printed Wiring Assembly and Interconnection Reliability.

Abstract

This report presents reliability prediction models for printed wiring assemblies, solderless wrap assemblies, wrapped and soldered assemblies, and discrete wiring assemblies w/electroless deposited PTH for inclusion in MIL-HDBK-217. Collected field failure rate data were utilized to develop and evaluate the factors. The reliability prediction models are presented in a form compatible with MIL-HDBK-217D, proposed. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1981
Accession Number
ADA111214

Entities

People

  • David W. Coit

Organizations

  • IIT Research Institute

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms

DTIC Thesaurus Topics

  • Accuracy
  • Assembly
  • Chemical Synthesis
  • Chemistry
  • Circuit Boards
  • Confidence Limits
  • Data Analysis
  • Databases
  • Electronics Industry
  • Failure Mode And Effect Analysis
  • Literature Surveys
  • Manufacturing
  • Materials
  • Printed Circuits
  • Regression Analysis
  • Stress Strain Relations
  • Test And Evaluation

Fields of Study

  • Engineering

Readers

  • Inertial Navigation Systems.
  • Integrated Circuit Design and Technology.
  • Software Engineering