Microelectronics Failure Analysis Techniques. A Procedural Guide

Abstract

The objective of this procedural guide was not to present an expose of device failure modes/mechanisms and applicable techniques for detection, identification and measurement but rather to provide a treatise on proven failure analysis techniques, equipment, procedures and expected analytical results. The guide thus represents a compilation and description of practical semiconductor failure analysis techniques rather than failure analysis flow sequences for verifying specific device failure mechanisms.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1980
Accession Number
ADA112062

Entities

People

  • Bill Morris
  • Ed Doyle Jr.

Organizations

  • General Electric

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Chemical Synthesis
  • Chemistry
  • Electronics Industry
  • Electronics Laboratories
  • Health Services
  • Material Degradation Processes
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Measurement
  • Medical Personnel
  • Modules (Electronics)
  • Organic Chemistry
  • Power Electronics
  • Semiconductors
  • Test And Evaluation

Fields of Study

  • Engineering

Readers

  • Computational Modeling and Simulation
  • Library and Information Science
  • Structural Health Monitoring of Composite Structures.

Technology Areas

  • Microelectronics