Microcircuit Package Stress Analysis.
Abstract
The response of various package components to various stressful environments is studied. The environments selected are among those that the package might experience in the course of mechanical screening by the methods of MIL-STD-883 ('Test Methods and Procedures for Microelectronics') or they are approximations and idealizations of conditions that the package might encounter in the field. Specifically, the following environments are considered: external pressure, constant acceleration, impact, sinusoidal vibration, and thermal shock. One or more chapters of the present report are devoted to each environment. The package types that are addressed in this study are generally those that can be described as flat and rectangular (which includes square). Thus, flatpacks and dual-in-line packages are included. The broad objective of this work is to direct attention, for each environment, to those package areas that are most directly affected by that environment, and to show, by means of analysis, what the major effects might be, in terms of stress and deformation.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 01, 1982
- Accession Number
- ADA113594
Entities
People
- Charles Libove
- Klod Kokini
- Richard W. Perkins
Organizations
- Syracuse University