Delidding and Resealing Hybrid Microelectronic Packages

Abstract

The objective of this single phase MM and T contract was to develop the manufacturing technology necessary for the precision removal (delidding) and replacement (resealing) of covers on hermetically sealed hybrid microelectronic packages. The equipment and processes developed provide a rework technique which does not degrade the reliability of the package of the enclosed circuitry. A qualification test was conducted on 88 functional hybrid packages, with excellent results. A petition will be filed, accompanied by this report, requesting Mil-M-38510 be amended to allow this rework method. (Author)

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1982
Accession Number
ADA115776

Entities

People

  • Wyatt F. Luce

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Human Systems
  • Space
  • Weapons Technologies

DTIC Thesaurus Topics

  • Air Force
  • Birds
  • Circuits
  • Crystal Structure
  • Electronics
  • End Milling
  • Engineering
  • Engineers
  • Environmental Tests
  • Glass Seals
  • Hybrid Circuits
  • Manufacturing
  • Materials
  • Materials Laboratories
  • Metal Seals
  • Resistance
  • Standards

Fields of Study

  • Engineering

Readers

  • Criminal Law
  • Software Engineering

Technology Areas

  • Microelectronics