Quality Assurance Procedures for LSI.

Abstract

Procurement of large hermetically sealed microcircuits in small quantities was found to require a specialized quality assurance test procedure which emphasizes process control. Samples of several complex circuits were fabricated and tested under a variety of controls to determine which environmental test methods were in need of modification. Recommendations are included. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1982
Accession Number
ADA116252

Entities

People

  • Lee A. Mirth

Organizations

  • Martin Marietta

Tags

Communities of Interest

  • Advanced Electronics
  • Space

DTIC Thesaurus Topics

  • Adhesion
  • Circuits
  • Contracts
  • Engineers
  • Fabrication
  • Failure Mode And Effect Analysis
  • High Temperature
  • Integrated Circuits
  • Large Scale Integration
  • Manufacturing
  • Materials
  • Pull Tests
  • Shear Tests
  • Test And Evaluation
  • Test Methods
  • Thick Films
  • Thin Films

Readers

  • Defense Acquisition Program Management
  • Integrated Circuit Design and Technology.
  • Regression Analysis.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene