Finite Element Analysis of Microelectronic Packages.

Abstract

New and innovative methods are being applied to the analysis of the mechanical integrity of microelectronic packages. This study resulted in 1) a summary of commercially available finite element computer programs for both structural and thermal analyses, 2) a categorization of microelectronic problems that can be evaluated using analytical techniques, 3) assessment of applicable analysis techniques, 4) cost comparisons of exposing failure modes by the use of computer analysis rather than physical test, and 4) to provide engineers with a base of technical knowledge necessary for the application of the finite element technique to solve microelectronic reliability problems. (Author)

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1982
Accession Number
ADA117979

Entities

People

  • J. R. Southland
  • V. R. Beatty
  • W. J. Vitaliano

Organizations

  • Harris Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuit Boards
  • Computational Fluid Dynamics
  • Computer Programs
  • Convection
  • Creep
  • Engineers
  • Finite Element Analysis
  • Fluid Flow
  • Heat Transfer
  • Integrated Circuits
  • Measurement
  • Mechanical Engineering
  • Mechanics
  • Modal Analysis
  • Resonant Frequency
  • Test Methods
  • Three Dimensional

Fields of Study

  • Engineering

Readers

  • Finite Element Method (FEM) for solving Partial Differential Equations (PDEs)
  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics