Evaluation Selection of Encapsulating Plastics for Ordnance Electronic Assemblies

Abstract

A program was conducted to evaluate new plastics for encapsulating ordnance electronic circuits. Various candidate plastics including foams, syntactic resins, filled systems, semirigids, elastomers and molded thermoplastics and thermosets were evaluated through extensive mechanical and environmental tests followed by encapsulation of test circuits. Additionally, a relative cost comparison of the various material categories was conducted to identify and quantify cost drivers.

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1981
Accession Number
ADA118714

Entities

People

  • Allan Goldberg
  • R. E. Isliefson
  • R. J. Ryan
  • Stephen J. Price

Organizations

  • Honeywell International, Inc.

Tags

Communities of Interest

  • Advanced Electronics
  • Energy and Power Technologies
  • Weapons Technologies

DTIC Thesaurus Topics

  • Biomedical And Dental Materials
  • Chemistry
  • Circuit Boards
  • Electronic Circuits
  • Electronic Components
  • Injection Molding
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Mechanical Working
  • Mechanics
  • Plastics
  • Resins
  • Tensile Strength
  • Thermal Properties

Fields of Study

  • Engineering

Readers

  • Electrical Engineering
  • Life Cycle Cost Analysis
  • Polymer Science and Engineering.

Technology Areas

  • Microelectronics