Liquid Cooled Variable Speed Constant Frequency (VSCF) Converter Device Development.

Abstract

Further miniaturization of high-power semi-conductor devices utilizing silicon disks larger than 12 mm. requires major innovations to improve the average thermal impedance and surge capability. The high thermal impedance in existing discrete devices is caused mostly by the dry interfaces necessary to provide stress relief. This report presents a unique approach to solving the dry interface problem. It describes the design, fabrication and evaluation of a smaller, lighter, electrically isolated dual thyristor module featuring structured copper, solder bonding, polyimide passivation, direct bonded copper on beryllium oxide and a hermetic sealed aluminum case. Details of the SCR modules evaluation in a 60 KVA single channel VSCF electrical generating system are included. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1982
Accession Number
ADA119424

Entities

People

  • John W. Butler

Organizations

  • General Electric

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Air Force
  • Barometric Pressure
  • Construction
  • Manufacturing
  • Materials
  • Materials Laboratories
  • Materials Testing
  • Measurement
  • Reliability
  • Semiconductor Devices
  • Semiconductors
  • Shock Tests
  • Silicon Controlled Rectifiers
  • Test And Evaluation
  • Test Methods
  • Thick Films
  • Visual Inspection

Readers

  • Electrical Engineering
  • Integrated Circuit Design and Technology.
  • Thermal Physics or Thermal Science.