Determination of Oxygen and Carbon in Silicon Wafers,
Abstract
Possibilities for the use of a dispersive infrared spectrophotometer to determine the oxygen and carbon content of device quality silicon wafers have been examined. A novel approach to the analysis of the spectra bassed on a curve fitting method has been employed. This has been shown to provide very good rejection of interferences due to absorptions caused by precipitates present in heat treated material. Single instrument precisions for measurements on 350 micrometers device quality wafers of better than 10% for oxygen and + or - 2 x 10 to the 16th power/cc for carbon with no correction for wafer backsurface finish are reported. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 01, 1982
- Accession Number
- ADA121376
Entities
People
- R. W. Series
Organizations
- Royal Signals and Radar Establishment