A Synergistic Solution to the Problem of Packaging and Interconnecting VLSI/VHSIC Chips.

Abstract

Solutions are required for the many problems faced by the chip packaging and interconnection systems industry for effectively meting the demanding application requirements of the rapidly emerging very-large scale integration/very-high speed integrated circuits (VLSI/VHSIC) chips. Present packaging technologies are being stretched beyond their original concepts thus requiring a new approach to the problem solution. The Military Electronics Systems Operations (MESO) has developed a new packaging approach, based on the Direct Bond Copper Process, which addressed these problems providing a completely integrated system. The problem solution starts at the chip level where en masse connections are made to the chip, chip heat is more effectively managed, low-cost chip hermetic seals accomplished, and then continues providing improved means for interconnecting many VLSI/VHSIC chips. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1982
Accession Number
ADA121587

Entities

People

  • J. Charles Gioia

Organizations

  • General Electric

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Assembly
  • Circuit Boards
  • Circuits
  • Computer-Aided Design
  • Engineering
  • Fabrication
  • Heat Sinks
  • Integrated Circuits
  • Large Scale Integration
  • Manufacturing
  • Materials
  • Printed Circuit Boards
  • Printed Circuits
  • Production
  • Semiconductors
  • Standards
  • Very Large Scale Integration

Fields of Study

  • Engineering

Readers

  • Electrical Engineering
  • Manufacturing Engineering.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics