Aging Study of an Adhesive and a Prepreg.

Abstract

This report provides data and results of studies performed on American Cyanamid's FM300 adhesive film aged under diverse conditions of temperature, time and humidity. At various times during the aging, physical properties of the adhesive were measured and the following methods were used to track the age of the adhesive: (1) dielectric analysis (DA), (2) dynamic mechanical analysis (DMA), and (3) a simple, easy to use time-temperature integrating device (TTW) which is carried with the material and provides a visual observation of the time and temperature exposure of the adhesive. It was found that DA, DMA, and the TTW can be used to follow the age of the adhesive and that they can be used as overage indicators to tell the user when the adhesive has lost its useful life. The indication by the TTW is less exact than by the other two methods.

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Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1982
Accession Number
ADA121897

Entities

People

  • Z. N. Sanjana

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Space
  • Weapons Technologies

DTIC Thesaurus Topics

  • Adhesives
  • Composite Materials
  • Contracts
  • Dissipation Factor
  • Films
  • Humidity
  • Indicators
  • Materials
  • Materials Engineering
  • Materials Laboratories
  • Materials Science
  • Measurement
  • Mechanical Properties
  • Military Aircraft
  • Peel Strength
  • Physical Properties
  • Shear Strength

Readers

  • Computer Science/Computer Engineering/Data Science/Digital Signal Processing.
  • Educational Psychology
  • Reinforced Composite Materials