Development of Improved Printed Wiring Board Inner Layer Adhesion.

Abstract

Polymide multilayer printed wiring baords (MLPWB) offer much higher temperature resistance than epoxy MLPWB, however, their usage has been limited due to inner layer delamination problems. This study has determined the primary cause of delamination as adhesive failure to inner layer copper surfaces. Copper surfacd treatments based on sodium chlorite when used with a ferric chloride/hydrochloric acid pre-etch have been found to eliminate these delamination problems. A test specimen based on ASTM D2733 has been developed for measuring the inner layer adhesion of MLPWB. Also evaluated was a floating roller technique for measuring the peel strength of copper foil. This technique gave consistent, low-chatter peel strength values. Analytical techniques were also developed for characterizing polymide pre-pregs. In general, the polymide pre-pregs were of high quality and excellent consistency. MLPWB's fabricated to those materials and processes optimized per this study exhibited excellent moisture and thermal resistances when tested per applicable military specifications. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1982
Accession Number
ADA122067

Entities

People

  • Thomas E. Baker

Organizations

  • RTX

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Body Weight
  • Chemical Synthesis
  • Chemistry
  • Circuit Boards
  • Composite Materials
  • Environment
  • Failure Mode And Effect Analysis
  • Liquid Chromatography
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Measurement
  • Mechanics
  • Printed Circuits
  • Reinforced Plastics
  • Test And Evaluation

Fields of Study

  • Materials science

Readers

  • Nanofabrication and Microfabrication.
  • Surface Coatings Technology.
  • Systems Analysis and Design