High-Reliability, Low-Cost Integrated Circuits.

Abstract

The objective of Phase III of this investigation was to demonstrate the reliability of the integrated circuits fabricated in Phase II according to the processes developed in Phase I (see Phase I and Phase II Final Development Reports for High-Reliability, Low-Cost Integrated Circuits, Contract No. N00039-76-C-0240). Devices were evaluated on the basis of a variety of life and environmental tests and the data recorded on magnetic tape for later retrieval and analysis. Computer software programs were developed to allow the data to be presented in a number of ways for evaluation and to allow the calculation of failure rates. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1982
Accession Number
ADA123115

Tags

Communities of Interest

  • Advanced Electronics
  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Computer Programs
  • Data Analysis
  • Economic Forecasting
  • Electronics
  • Electronics Laboratories
  • Environmental Tests
  • Failure Analysis
  • Failure Mode And Effect Analysis
  • High Reliability
  • Integrated Circuits
  • Life Tests
  • Magnetic Tape
  • Reliability
  • Semiconductors
  • Shock Tests
  • Test And Evaluation
  • Thermal Shock

Fields of Study

  • Engineering

Readers

  • Business Analytics
  • Organizational Process Management (OPM).
  • Radio communications and signal processing.