Study of Mechano-Chemical Machining of Ceramics and the Effect on Thin Film Behavior.

Abstract

Efforts have been made in this program to develop mechanochemical polishing technique for a number of materials and to determine the consequences of mechanochemically polished surfaces on the physical performance of ceramics. The objective of the mechanochemical polishing efforts is to produce scratch-and-damage-free surfaces by finding suitable soft abrasives that remove material from the workpiece through chemical reactions. Mechanochemical polishing effects were observed when hotpressed and reaction bonded SI3N4 were polished with two oxides of iron, Fe2O3 and Fe3O4. Mechanochemicallly polished surfaces of Si3N4 were analyzed using the techniques of Auger electro spectroscopy, profilometry and interferometry. Data showing the effects of mechanochemical polishing on the strength of hot-pressed Si3N4 and on the adhesion of thin titanium films on this material have been obtained. Also preliminary efforts have been made to find suitable soft abrasives for mechanochemical polishing of GaAs, Spinel (MgO.A12O3) Sic, B4C,and partially stabilized Zro2.

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1983
Accession Number
ADA125342

Entities

People

  • Heli Vora
  • R. J. Stokes

Organizations

  • Honeywell International, Inc.

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Auger Electron Spectroscopy
  • Auger Electrons
  • Ceramic Materials
  • Chemical Reactions
  • Electron Spectroscopy
  • Electronics
  • Electronics Laboratories
  • Materials
  • Materials Engineering
  • Materials Science
  • Measurement
  • Military Research
  • Physics Laboratories
  • Silicon Carbide
  • Spectra
  • Surface Finishing
  • Surface Roughness

Fields of Study

  • Materials science

Readers

  • Nanocomposite Materials Science
  • Powder metallurgy of Titanium alloys.
  • Semiconductor Device Technology