Materials Research for Advanced Inertial Instrumentation. Task 1. Dimensional Stability of Gyroscope Structural Materials.

Abstract

Microstructure evaluations of HIP50 and X-520 experimentally produced grades of Be materials were continued during this reporting period. These materials were examined by transmission as well as scanning transmission electron microscopy (TEM/STEM) techniques. Gentle procedures were developed for producing appropriate samples for this purpose. Work performed during this recent study was substantially more extensive than efforts made previously and included a determination of second phase particle size, number density, elemental composition and their distribution in the material. Several notable difference were observed between the two beryllium grades and these appeared to explain the differences in the microyield strength (MYS) property behavior that was determined and reported upon in prior annual reports. A substantial amount of effort was expended on the construction of the 10 to the -7th power inch/inch tensile microcreep measuring facility that was designed and discussed earlier. An oven capable of controlling sample temperature within 0.02 degrees F was constructed and tested. The load train and novel design thin film capacitive extensometer were also built. Preliminary evaluations of these components and all support electronics were made and determined to be quite satisfactory.

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1982
Accession Number
ADA125763

Entities

People

  • D. Cardarelli
  • F. Petri
  • K. Kumar

Organizations

  • Charles Stark Draper Laboratory

Tags

Communities of Interest

  • Advanced Electronics
  • Weapons Technologies

DTIC Thesaurus Topics

  • Assembly
  • Chemistry
  • Electron Microscopes
  • Electron Microscopy
  • Electronics
  • Manufacturing
  • Materials
  • Materials Engineering
  • Materials Processing
  • Materials Science
  • Measurement
  • Mechanical Properties
  • Military Research
  • Particle Size
  • Test And Evaluation
  • Transmission Electron Microscopy
  • X Rays

Readers

  • Mechanical Engineering/Mechanics of Materials.
  • Technical Research and Report Writing.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics