Evaluation of In-Package Performance of Antistatic Materials.
Abstract
For the past several years, DARCOMPSCC has been concerned with the appropriateness of test methods for determining the in-package performance of static-sensitive components and the required associated packaging materials. These fears were prompted by two developments which have occurred simultaneously over a previous minimum 10-year period. The first has been the greatly accelerated usage of plastics in all forms for packaging; the second being the steadily increasing complexity and miniaturization of solid state electronic components. Regarding the latter, generally, the smaller the part, the less power it can dissipate, the thinner the insulating layers, and the more susceptible it is to static degradation. This sensitivity can produce immediate destruction of the component (whether alone or assembled into circuits) or it can allow damage which is not detectable until a later time when failure eventually occurs. Static-sensitive components include MOS, CMOS, FET, junctions, bi-polar and microwave diodes, and thick film precision resistors. The static charge itself may be produced by in-transit vibration which causes movement of both the item and intimately applied packaging materials both within unit packs and from outside sources. Static sources include the full range of the newer plastic packaging materials as well as packaging, handling, and user personnel associated with the life cycle of military components. Even the older, more common packaging materials (i.e., barriers, wraps, cushioning, and tapes) cannot be excluded as a potential static source.
Document Details
- Document Type
- Technical Report
- Publication Date
- Nov 01, 1980
- Accession Number
- ADA126111
Entities
People
- John S. Ladiko
- Robert Mcgill