The Cooling of Printed Circuit Board Mounted Components Using Copper Ladder Heat Conduction to a Cold Wall.

Abstract

This Report describes a series of experimental tests, designed to investigate the cooling of printed circuit board (PCB) mounted dual-in-line (DIL) components within an avionic box using the copper ladder/cold wall technique. Areas of investigation include avionic box orientation, side wall conduction, top plate finning, mixed 'air-wash', avionic power reduction, cooling air temperature reduction, cooling air mass flowrate reduction, cold wall heat pick-up and avionic box insulation. Results were obtained from thermocouple temperature measurements, details of the instrumentation used as well as the thermocouple and component layout within the avionic box are included. The use of an aluminum alloy 'interplate' to cool two adjacent PCBs is also discussed. Results in graphical form are included together with a list of conclusions on the effects of all the major parameters considered.

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Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1982
Accession Number
ADA129350

Entities

People

  • I. C. Dale

Organizations

  • Royal Aircraft Establishment

Tags

Communities of Interest

  • Energy and Power Technologies
  • Weapons Technologies

DTIC Thesaurus Topics

  • Air Masses
  • Air Temperature
  • Aluminum
  • Aluminum Alloys
  • Circuit Boards
  • Dielectric Polymers
  • Electronic Equipment
  • Energy Consumption
  • Heat Transfer
  • Measurement
  • Oils
  • Plastic Explosives
  • Polystyrenes
  • Power Supplies
  • Printed Circuit Boards
  • Printed Circuits
  • Test Equipment

Fields of Study

  • Engineering

Readers

  • Combustion and Flow Dynamics.
  • Integrated Circuit Design and Technology.
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics