MM&T--Ceramic Metal Substrates for Hybrid Electronics

Abstract

The objective was to detail the technology relevant to high volume production of thick-film hybrid electronics made with insulated-metal substrates. The technology applicable to ordnance projectile-fuze electronics was emphasized. The program was divided into several tasks to explore the critical elements of thick-film hybrid manufacturing. First, all physical, thermal, electrical, and chemical properties of commercially available porcelain-enameled steel (PES) substrates which affect their thick-film performance were measured and analyzed. Next, the properties of numerous thick- film conductors, dielectrics, and resistors were complied. Solderability and wire bondability of numerous conductors were evaluated. Properties of three vendors' resistor inks covering the full resistance range wee characterized. Effects of firing temperature variation on thick-film properties were analyzed. A small pilot production line was implemented using materials and processes established in the above tasks. Two batched totalling 150 units of a moderately complex hybrid fuze amplifier completed thick film fabrication with approximately 75 percent yield. Ten complete amplifiers were delivered to HDL for test. The feasibility of building ordnance hybrids on PES substrates in large volume is discussed. Factors limiting the feasibility are identified. Areas where material development is necessary are indicated.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1983
Accession Number
ADA132514

Entities

People

  • A. B. Timberlake
  • F. E. Merti

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Carbon Steels
  • Chemistry
  • Dielectric Properties
  • Dielectrics
  • Fabrication
  • Heat Transfer
  • Integrated Circuits
  • Manufacturing
  • Manufacturing Engineering
  • Materials
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Measurement
  • Steel
  • Tensile Strength
  • Test And Evaluation

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Surface Engineering/Surface Coating Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene